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Winbond Wpce773la0dg Datasheet Pdf 14

Winbond Wpce773la0dg Datasheet Pdf 14: A Comprehensive Guide

Winbond Wpce773la0dg Datasheet Pdf 14: A Comprehensive Guide

If you are looking for a reliable and versatile embedded controller for your laptop or notebook, you might want to consider the Winbond Wpce773la0dg. This device is a highly integrated power management IC that supports ACPI (Advanced Configuration and Power Interface) and provides various functions such as keyboard scan, fan control, thermal management, battery charging and discharging, and system wake-up events. In this article, we will provide you with a comprehensive guide on the Winbond Wpce773la0dg datasheet pdf 14, which is the latest version of the document that contains detailed information about the device’s features, specifications, pin assignments, register maps, and application examples.

Features of Winbond Wpce773la0dg

The Winbond Wpce773la0dg has many features that make it suitable for various laptop and notebook applications. Some of the main features are:

  • Supports ACPI specification revision 4.0 and Intel Mobile Platform Innovation Framework
  • Supports multiple power planes and dynamic voltage scaling
  • Supports Smart Battery System (SBS) interface and battery gauge function
  • Supports fan speed control and thermal monitoring
  • Supports keyboard matrix scan up to 24×8
  • Supports PS/2 interface for external mouse and keyboard
  • Supports SPI (Serial Peripheral Interface) flash interface for BIOS storage
  • Supports LPC (Low Pin Count) interface for legacy I/O devices
  • Supports SMBus (System Management Bus) interface for communication with other devices
  • Supports GPIO (General Purpose Input/Output) pins for various functions
  • Supports PWM (Pulse Width Modulation) output for LED backlight control
  • Supports watchdog timer and system reset function
  • Built-in 8051 microcontroller with 32 KB internal ROM and 256 bytes internal RAM
  • Operates from 3.3 V or 5 V power supply with low power consumption
  • Available in 128-pin LQFP (Low-profile Quad Flat Package) package

Specifications of Winbond Wpce773la0dg

Features of Winbond Wpce773la0dg

The Winbond Wpce773la0dg datasheet pdf 14 provides the following specifications for the device:

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Parameter Value
Clock frequency 24 MHz (internal oscillator)
Operating voltage VCC = 3.3 V or 5 V ±10%
Operating temperature -40°C to +85°C
Power consumption Typical: 60 mA (VCC = 3.3 V), 80 mA (VCC = 5 V)
Standby: 10 µA (VCC = 3.3 V), 15 µA (VCC = 5 V)
LQFP package size 14 mm x 14 mm x 1.4 mm
LQFP package pins 128 pins (32 x 4)
LQFP package pitch 0.5 mm
LQFP package weight 0.6 g (typical)
LQFP package marking “WPCE773LAODG” or “WPCE773LA0DG”
LQFP package RoHS compliance Yes
LQFP package lead-free soldering temperature 260°C (maximum)
LQFP package moisture sensitivity level MSL 3 (maximum)